EnVerv garners $15.4 mln

EnVerv has secured $15.4 million in Series C financing. The investors were Cassiopeia Capital Partners, Cisco, UMC Capital, Benchmark Capital, NEA and Walden International. Headquartered in Milpitas, Calif., EnVerv is a fabless semiconductor company.

PRESS RELEASE

EnVerv Inc., an innovative fabless semiconductor company and a leading provider of high performance communications and metering System on Chip (SoC) solutions for the Advanced Metering Infrastructure (AMI), smart grid, solar and other grid connectivity markets, announced today the closing of its $15.4M round of series C financing with participation from Cassiopeia Capital Partners, Cisco, UMC Capital and existing investors Benchmark Capital, NEA and Walden International.
“We are very glad to have raised this sizable round of investment,” said Michael Raam, CEO and President of EnVerv. “This round further underscores our dedication to providing high-performance SoC solutions to our customers. We intend to utilize this capital to support the production ramps, expand our customer base, and also continue the development of new product families in wired and wireless communications as well as metering market segments.”
“Our investment in EnVerv signifies our belief in not only their business model and product offerings but also their execution in combining complex communication algorithms with high levels of integration in offering the lowest power and most cost-effective single chip solutions to their customers,” said Frank Lee of UMC Capital.
About EnVerv Inc.
EnVerv is a fabless semiconductor company in the United States with headquarters in Milpitas, California. The company’s SoC solutions enable robust and high-speed communications over Low Voltage (LV) and Medium Voltage (MV) power lines that are applicable to various grid connectivity markets such as AMI, solar micro-inverters, transformer monitoring, substation communications, lighting networks, etc. EnVerv’s family of communications SoC solutions comprises single-chip soft-modems and covers ITU-T G.9903 (G3-PLC), ITU-T (G.9904) PRIME, IEEE 1901.2 and IEC-61334 (S-FSK) standards across CENELEC, FCC and ARIB frequency bands. For more information please visit www.enverv.com.

Related Posts

Leave a Reply

PEHUB Community

Join the 12501 members of peHUB to make connections, share your opinion, and follow your favorite authors.

Join the Community

Look Who’s Tweeting

Psst! Got any hot tips?

  • This field is for validation purposes and should be left unchanged.

PE HUB News Briefs

RSS Feed Widget

Marketplace

VCJ Headlines (subscribers only)

RSS Feed Widget

Buyouts Headlines (subscribers only)

RSS Feed Widget

Reuters VC and PE feed

RSS Feed Widget