BCD Semiconductor Manufacturing Ltd., a Shanghai-based analog integrated device manufacturer, has filed for a $75.9 million IPO. It plans to trade on the Nasdaq under ticker symbol BCDS, with Deutsche Bank Securities serving as lead underwriter.
The company has raised around $64 million in VC funding since 2002, from Core Capital (23.29% pre-IPO stake), Venrock (7.24%), New Enterprise Associates (7.03%), SAIL Financial Group (5.38%), Intel Capital, iD Ventures America, Redpoint Ventures, Jafco and Granite Global Ventures.
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