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Inside Contactless Expands Third Round

Inside Contactless, a French maker of “contactless” payment chips and NFC technologies for mobile devices, expanded its Series C round to a total of nearly $42 million. Samsung Ventures America participated in the latest tranche, which followed a $38 million first close. Other round backers include Nokia Growth Partners, Sofinnova Partners, Vertex Management, Vertex Ventures, Siparex, GIMV, EuroUS Venture, Granite Global Ventures and Visa Ventures.




Extending its previously announced series C funding round, INSIDE Contactless, the world leader in advanced contactless microprocessor platforms, today added Samsung Ventures America to its active investor community, which now includes the world's top three handset manufacturers. Samsung Ventures' participation builds upon investments from Nokia Growth Partners, Motorola Ventures and other institutional investors, providing a total of nearly $42 million (