BCD Semiconductor Manufacturing Ltd., a Shanghai-based analog integrated device manufacturer, has postponed its IPO, due to market conditions. The company had filed for a $75.9 million offering in late January, with plans to list on the Nasdaq. It later lowered its upper target to $66 million. Deutsche Bank Securities is serving as lead underwriter.
BCD has raised around $64 million in VC funding since 2002, from Core Capital (23.29% pre-IPO stake), Venrock (7.24%), New Enterprise Associates (7.03%), SAIL Financial Group (5.38%), Intel Capital, iD Ventures America, Redpoint Ventures, Jafco and Granite Global Ventures.